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MPD-6000

使用专用Pellicle Demount Jig，手动去除胶合在半导体
Wafer用Photo Mask上的Pellicle。
(5″,6″,7″ & 9" 等)

Dimension (mm)	500 (W) x 600 (D) x 300 (H)
Weight (kg)	Approximately 40 kg
Demounting Time	1~9999 sec
Demounting Temperature	25~200 ℃
Demounting Method	- Mask Heating - Demounting Pellicle with a Pellicle Jig
Equipment Condition	- PLC Control - Swith Operation - 5",6",7" & 9" Photo Mask
Option	- Pellicle Demount Jig
Utility	- Power : 1Phase AC200~220V, 50/60Hz - CDA : ¼” (0.5 ~ 0.7 Mpa)